Any piece of integrated circuit is designed for the completion of certain electrical characteristics and functions of the monolithic module, IC test is the test of integrated circuit, is the use of various methods to detect those in the manufacturing process due to physical defects caused by the sample does not meet the requirements. If there is a defect free product, IC testing is not needed. Because the actual manufacturing process and the material itself have more or less defects, so no matter how perfect the product will produce bad individuals, so testing has become one of the indispensable engineering in integrated circuit manufacturing. IC test generally it is divided into two parts: before the process and after the process.

before

The process includes:

(1) The rough silicon ore is transformed into high purity monocrystalline silicon.

 

(2) Manufacture various IC components on the Wafer.

 

(3) Test the IC chip on the Wafer.

 

Process after the

The process includes:

 

(1) Slice (cut) the Wafer

 

(2) Encapsulate and test the IC chip